{"id":12972,"date":"2022-07-01T12:26:17","date_gmt":"2022-07-01T09:26:17","guid":{"rendered":"http:\/\/journals.khnu.km.ua\/vestnik\/?p=12972"},"modified":"2023-02-01T23:12:50","modified_gmt":"2023-02-01T21:12:50","slug":"vplyv-germetyzacziyi-na-vynyknennya-ta-peredachu-temperaturnyh-deformaczij-elektronnyh-moduliv","status":"publish","type":"post","link":"https:\/\/journals.khnu.km.ua\/vestnik\/?p=12972","title":{"rendered":"\u0412\u043f\u043b\u0438\u0432 \u0433\u0435\u0440\u043c\u0435\u0442\u0438\u0437\u0430\u0446\u0456\u0457 \u043d\u0430 \u0432\u0438\u043d\u0438\u043a\u043d\u0435\u043d\u043d\u044f \u0442\u0430 \u043f\u0435\u0440\u0435\u0434\u0430\u0447\u0443 \u0442\u0435\u043c\u043f\u0435\u0440\u0430\u0442\u0443\u0440\u043d\u0438\u0445 \u0434\u0435\u0444\u043e\u0440\u043c\u0430\u0446\u0456\u0439 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u0438\u0445 \u043c\u043e\u0434\u0443\u043b\u0456\u0432"},"content":{"rendered":"

<\/p>\n

\u0412\u041f\u041b\u0418\u0412 \u0413\u0415\u0420\u041c\u0415\u0422\u0418\u0417\u0410\u0426\u0406\u0407 \u041d\u0410 \u0412\u0418\u041d\u0418\u041a\u041d\u0415\u041d\u041d\u042f \u0422\u0410 \u041f\u0415\u0420\u0415\u0414\u0410\u0427\u0423 \u0422\u0415\u041c\u041f\u0415\u0420\u0410\u0422\u0423\u0420\u041d\u0418\u0425 \u0414\u0415\u0424\u041e\u0420\u041c\u0410\u0426\u0406\u0419 \u0415\u041b\u0415\u041a\u0422\u0420\u041e\u041d\u041d\u0418\u0425 \u041c\u041e\u0414\u0423\u041b\u0406\u0412<\/p>\n

INFLUENCE OF THE SEALING ON APPEARANCE AND TRANSMISSION OF TEMPERATURE DEFORMATIONS IN ELECTRONIC MODULES<\/p>\n

\u0421\u0442\u043e\u0440\u0456\u043d\u043a\u0438:\u00a0<\/strong>150<\/strong>–<\/strong>157<\/strong>. \u041d\u043e\u043c\u0435\u0440: \u21163, 2022 (309)<\/strong> \"\"<\/a>
\n\u0410\u0432\u0442\u043e\u0440\u0438:<\/strong>
\n\u041a\u041e\u0412\u0422\u0423\u041d \u0406. \u0406.
\nhttps:\/\/orcid.org\/0000-0002-1430-6479<\/a>
\n\u041f\u0415\u0422\u0420\u0410\u0429\u0423\u041a \u0421. \u0410.
\nhttps:\/\/orcid.org\/0000-0003-2043-1409<\/a>
\n\u0411\u041e\u0419\u041a\u041e \u042e. \u041c.
\nhttps:\/\/orcid.org\/0000-0003-0603-7827<\/a>
\n\u0425\u043c\u0435\u043b\u044c\u043d\u0438\u0446\u044c\u043a\u0438\u0439 \u043d\u0430\u0446\u0456\u043e\u043d\u0430\u043b\u044c\u043d\u0438\u0439 \u0443\u043d\u0456\u0432\u0435\u0440\u0441\u0438\u0442\u0435\u0442
\nIgor KOVTUN, Svitlana PETRASHCHUK, Juliy BOIKO
\nKhmeln\u0443tsky\u0456 National University
\nDOI:<\/strong>\u00a0https:\/\/www.doi.org\/10.31891\/2307-5732-2022-309-3-150-157<\/a><\/p>\n

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\n\u041a\u043b\u044e\u0447\u043e\u0432\u0456 \u0441\u043b\u043e\u0432\u0430:<\/strong> \u0433\u0435\u0440\u043c\u0435\u0442\u0438\u0437\u043e\u0432\u0430\u043d\u0438\u0439 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u0438\u0439 \u043c\u043e\u0434\u0443\u043b\u044c, \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u0438\u0439 \u043a\u043e\u043c\u043f\u043e\u043d\u0435\u043d\u0442, \u043a\u043e\u043c\u043f\u0430\u0443\u043d\u0434, \u043c\u0456\u0446\u043d\u0456\u0441\u0442\u044c, \u043d\u0430\u043f\u0440\u0443\u0436\u0435\u043d\u043e-\u0434\u0435\u0444\u043e\u0440\u043c\u043e\u0432\u0430\u043d\u0438\u0439 \u0441\u0442\u0430\u043d<\/p>\n

\u0420\u043e\u0437\u0448\u0438\u0440\u0435\u043d\u0430 \u0430\u043d\u043e\u0442\u0430\u0446\u0456\u044f \u0430\u043d\u0433\u043b\u0456\u0439\u0441\u044c\u043a\u043e\u044e \u00a0\u043c\u043e\u0432\u043e\u044e<\/strong><\/p>\n

The scientific result presented in this paper consists in development of the Lame-Gadolin theory about\u00a0 \u00a0interaction of joint thick-walled cylinders application to estimate strength of electronic components represented by \u00a0bodies of revolution and surrounding layer of compound sealed by an arbitrary shape subjected to thermal impacts in the temperature range from +70 to -60 deg C. The difference in the coefficients of linear thermal expansion and other physical and mechanical characteristics of compound and electronic components under the temperature changes produces a contact pressure on their contact area causing thermal strain and stress in materials of both bodies in the sealed structure. Within the framework of the axisymmetric problem, the stress-strain condition of the electronic component-compound system has been assessed in condition of thermal impact, due to which the pattern of the maximum total radial, circumferential and axial stresses has been revealed depending on their radial distribution and the temperature load mode. The stress estimation in the S2-29V resistor sealed with the EZK-25 compound inside the sealed electronic package has been performed at the constant temperature drop. The experimental method is proposed for determining the ultimate stresses in electronic components sealed with compound under stress and strain condition identical to the operational one. Experimental measurement of circumferential and axial strains was carried out by using method of electrotensometry. Thermal impacts were reproduced in the thermostat and the climatic chamber. Technological methods for protection of electronic components in the structures of electronic packages sealed with compound has been proposed by embedding elastic and dissipative joints between electronic components and a sealant, and the effectiveness of their application is experimentally evaluated based on determination of the damping coefficient.
\nKeywords:<\/strong> sealed electronic package, electronic component, compound, strength, stress and strain condition<\/p>\n

\u041b\u0456\u0442\u0435\u0440\u0430\u0442\u0443\u0440\u0430<\/strong><\/p>\n

    \n
  1. Robertson C. T. Printed Circuit Board Designer’s Reference: Basics \/ C. T. Ro-bertson. \u2013 New Jersey : Prentice Hall Professional, 2003. \u2013 277 \u0440.<\/li>\n
  2. Tong J. P. C. A DMAIC approach to printed circuit board quality improvement \/ J. P. C. Tong, F. Tsung, B. P. C. Yen \/\/ The International Journal of Advanced Manufacturing Technology. \u2013 London : Springer, 2004. \u2013 Vol. 23, Issue 7\u20138. \u2013 \u0420. 523\u2013531.<\/li>\n
  3. Electronic packaging: design, materials, process, and reliability \/ John H. Lau, C. P. Wong, John L. Prince, Wataru Nakayama. \u2013 New York : McGraw-Hill Professional, 1998 \u2013 496 p.<\/li>\n
  4. \u0414\u0421\u0422\u0423 2634\u201394. \u0412\u0438\u0440\u043e\u0431\u0438 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u043e\u0457 \u0442\u0435\u0445\u043d\u0456\u043a\u0438. \u041c\u0435\u0442\u043e\u0434\u0438 \u043e\u0446\u0456\u043d\u044e\u0432\u0430\u043d\u043d\u044f \u0432\u0456\u0434\u043f\u043e\u0432\u0456\u0434\u043d\u043e\u0441\u0442\u0456 \u0432\u0438\u043c\u043e\u0433\u0430\u043c \u0434\u043e \u043d\u0430\u0434\u0456\u0439\u043d\u043e\u0441\u0442\u0456. \u2013 [\u0427\u0438\u043d\u043d\u0438\u0439 \u0432\u0456\u0434 1995-07-01]. \u2013 \u041a\u0438\u0457\u0432 : \u0414\u0435\u0440\u0436\u0441\u043f\u043e\u0436\u0438\u0432\u0441\u0442\u0430\u043d\u0434\u0430\u0440\u0442 \u0423\u043a\u0440\u0430\u0457\u043d\u0438, 1995. \u2013 4 \u0441.<\/li>\n
  5. \u0414\u0421\u0422\u0423 7655:2014. \u0412\u0438\u0440\u043e\u0431\u0438 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u043e\u0457 \u0442\u0435\u0445\u043d\u0456\u043a\u0438. \u0417\u0430\u0433\u0430\u043b\u044c\u043d\u0456 \u0432\u0438\u043c\u043e\u0433\u0438 \u0449\u043e\u0434\u043e \u043d\u0430\u0434\u0456\u0439\u043d\u043e\u0441\u0442\u0456 \u0442\u0430 \u043c\u0435\u0442\u043e\u0434\u0438 \u0432\u0438\u043f\u0440\u043e\u0431\u0443\u0432\u0430\u043d\u043d\u044f. \u2013 [\u041d\u0430 \u0437\u0430\u043c\u0456\u043d\u0443 \u0413\u041e\u0421\u0422 25359-82 ; \u0447\u0438\u043d\u043d\u0438\u0439 \u0432\u0456\u0434 2015-07-01]. \u2013 \u041a\u0438\u0457\u0432 : \u0414\u0435\u0440\u0436\u0441\u043f\u043e\u0436\u0438\u0432\u0441\u0442\u0430\u043d\u0434\u0430\u0440\u0442 \u0423\u043a\u0440\u0430\u0457\u043d\u0438, 2009. \u2013 9 \u0441.<\/li>\n
  6. \u0414\u0421\u0422\u0423 8216:2015. \u0412\u0438\u0440\u043e\u0431\u0438 \u0435\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u043e\u0457 \u0442\u0435\u0445\u043d\u0456\u043a\u0438. \u041a\u043b\u0430\u0441\u0438\u0444\u0456\u043a\u0430\u0446\u0456\u044f \u0437\u0430 \u0443\u043c\u043e\u0432\u0430\u043c\u0438 \u0437\u0430\u0441\u0442\u043e\u0441\u0443\u0432\u0430\u043d\u043d\u044f \u0442\u0430 \u0432\u0438\u043c\u043e\u0433\u0438 \u0441\u0442\u0456\u0439\u043a\u043e\u0441\u0442\u0456 \u0434\u043e \u0437\u043e\u0432\u043d\u0456\u0448\u043d\u0456\u0445 \u0432\u043f\u043b\u0438\u0432\u043e\u0432\u0438\u0445 \u0447\u0438\u043d\u043d\u0438\u043a\u0456\u0432. \u2013 \u041a\u0438\u0457\u0432 : \u0414\u0435\u0440\u0436\u0441\u043f\u043e\u0436\u0438\u0432\u0441\u0442\u0430\u043d\u0434\u0430\u0440\u0442 \u0423\u043a\u0440\u0430\u0457\u043d\u0438, 2017. \u2013 11 \u0441.<\/li>\n
  7. \u041f\u0440\u043e\u0433\u043d\u043e\u0437\u0438\u0440\u043e\u0432\u0430\u043d\u0438\u0435 \u043d\u0430\u0434\u0451\u0436\u043d\u043e\u0441\u0442\u0438 \u0443\u0437\u043b\u043e\u0432 \u0438 \u0431\u043b\u043e\u043a\u043e\u0432 \u0440\u0430\u0434\u0438\u043e\u0442\u0435\u0445\u043d\u0438\u0447\u0435\u0441\u043a\u0438\u0445 \u0443\u0441\u0442\u0440\u043e\u0439\u0441\u0442\u0432 \u043a\u043e\u0441\u043c\u0438\u0447\u0435\u0441\u043a\u043e\u0433\u043e \u043d\u0430\u0437\u043d\u0430\u0447\u0435\u043d\u0438\u044f \u043d\u0430 \u043e\u0441\u043d\u043e\u0432\u0435 \u043c\u043e\u0434\u0435\u043b\u0438\u0440\u043e\u0432\u0430\u043d\u0438\u044f \u043d\u0430\u043f\u0440\u044f\u0436\u0451\u043d\u043d\u043e-\u0434\u0435\u0444\u043e\u0440\u043c\u0438\u0440\u0443\u0435\u043c\u044b\u0445 \u0441\u043e\u0441\u0442\u043e\u044f\u043d\u0438\u0439 : \u043c\u043e\u043d\u043e\u0433\u0440\u0430\u0444\u0438\u044f \/ \u0421. \u0411. \u0421\u0443\u043d\u0446\u043e\u0432, \u0412. \u041f. \u0410\u043b\u0435\u043a\u0441\u0435\u0435\u0432, \u0412. \u041c. \u041a\u0430\u0440\u0430\u0431\u0430\u043d, \u0421. \u0412. \u041f\u043e\u043d\u043e\u043c\u0430\u0440\u0451\u0432. \u2013 \u0422\u043e\u043c\u0441\u043a : \u0418\u0437\u0434-\u0432\u043e \u0422\u043e\u043c\u0441\u043a. \u0433\u043e\u0441. \u0443\u043d-\u0442\u0430 \u0441\u0438\u0441\u0442\u0435\u043c \u0443\u043f\u0440. \u0438 \u0440\u0430\u0434\u0438\u043e\u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u0438\u043a\u0438, 2012. \u2013 114 \u0441.<\/li>\n
  8. \u0422\u0430\u043b\u0438\u0446\u043a\u0438\u0439 \u0415. \u041d. \u0417\u0430\u0449\u0438\u0442\u0430 \u044d\u043b\u0435\u043a\u0442\u0440\u043e\u043d\u043d\u044b\u0445 \u0441\u0440\u0435\u0434\u0441\u0442\u0432 \u043e\u0442 \u043c\u0435\u0445\u0430\u043d\u0438\u0447\u0435\u0441\u043a\u0438\u0445 \u0432\u043e\u0437\u0434\u0435\u0439\u0441\u0442\u0432\u0438\u0439. \u0422\u0435\u043e\u0440\u0435\u0442\u0438\u0447\u0435\u0441\u043a\u0438\u0435 \u043e\u0441\u043d\u043e\u0432\u044b \/ \u0415. \u041d. \u0422\u0430\u043b\u0438\u0446\u043a\u0438\u0439. \u2013 \u0412\u043b\u0430\u0434\u0438\u043c\u0438\u0440 : \u0412\u043b\u0430\u0434\u0438\u043c. \u0433\u043e\u0441. \u0443\u043d-\u0442., 2001. \u2013 256 \u0441.<\/li>\n
  9. Singh \u0422. Failure Modes and Mechanisms in Electronic Packages \/ \u0422. Singh., P. Viswanadham. \u2013 Boston : Chapman & Hall, MA: Springer, 1998. \u2013 \u0420. 363.<\/li>\n
  10. Calculation of mechanical stresses in adjoint system of electronic component and compound and strength assessment \/ V. Royzman, S. Petrashchuk, I. Kovtun, A. Lokoshchenko \/\/ Journal of Vibroengineering. \u2013 Vilnius, 2013. \u2013 Vol. 15, Issue 1. \u2013 P. 65\u201371.<\/li>\n
  11. \u041f\u0438\u0441\u0430\u0440\u0435\u043d\u043a\u043e \u0413. \u0421. \u041e\u043f\u0456\u0440 \u043c\u0430\u0442\u0435\u0440\u0456\u0430\u043b\u0456\u0432 \/ \u0413. \u0421. \u041f\u0438\u0441\u0430\u0440\u0435\u043d\u043a\u043e, \u041e. \u041b. \u041a\u0432\u0456\u0442\u043a\u0430, \u0415. \u0421. \u0423\u043c\u0430\u043d\u0441\u044c\u043a\u0438\u0439 ; \u0437\u0430 \u0440\u0435\u0434. \u0413. \u0421. \u041f\u0438\u0441\u0430\u0440\u0435\u043d\u043a\u0430. \u2013 2-\u0435 \u0432\u0438\u0434. \u0434\u043e\u043f\u043e\u0432. \u0456 \u043f\u0435\u0440\u0435\u0440\u043e\u0431. \u2013 K\u0438\u0457\u0432 : \u0412\u0438\u0449\u0430 \u0448\u043a\u043e\u043b\u0430, 2004. \u2013 655 \u0441.<\/li>\n
  12. Petrashchuk S. Solving Problem of Thermal Conduction for Providing Strength of Electronic Units on Thermal Impacts \/ S. Petrashchuk, I. Kovtun, A. Voznyak \/\/ Heat and Mass Transfer in the System of Thermal Modes of Energy. Technical and Technological Equipment (HMTTSC-2016): MATEC Web of Conferences (Tomsk, April 19-21, 2016). \u2013 Vol. 72. \u2013 5.<\/li>\n
  13. Kovtun I. Thermal stress in encapsulated electronic packages \/ I. Kovtun, S. Petrashchuk, J. Boiko \/\/ Proceedings of the IEEE International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo), (Odessa, Ukraine, 9\u201313 September, 2019). \u2013 \u0420. 6.<\/li>\n
  14. \u0420\u043e\u0439\u0437\u043c\u0430\u043d\u00a0\u0412.\u00a0\u041f. \u0406\u0434\u0435\u043d\u0442\u0438\u0444\u0456\u043a\u0430\u0446\u0456\u044f \u0444\u0456\u0437\u0438\u043a\u043e-\u043c\u0435\u0445\u0430\u043d\u0456\u0447\u043d\u0438\u0445 \u0445\u0430\u0440\u0430\u043a\u0442\u0435\u0440\u0438\u0441\u0442\u0438\u043a \u043f\u043e\u043b\u0456\u043c\u0435\u0440\u043d\u0438\u0445 \u043c\u0430\u0442\u0435\u0440\u0456\u0430\u043b\u0456\u0432 \/ \u0412.\u00a0\u041f.\u00a0\u0420\u043e\u0439\u0437\u043c\u0430\u043d, \u0406.\u00a0\u0406.\u00a0\u041a\u043e\u0432\u0442\u0443\u043d, \u0421.\u00a0\u0410.\u00a0\u041f\u0435\u0442\u0440\u0430\u0449\u0443\u043a \/\/ \u0412\u0456\u0441\u043d\u0438\u043a \u0422\u0435\u0445\u043d\u043e\u043b\u043e\u0433\u0456\u0447\u043d\u043e\u0433\u043e \u0443\u043d\u0456\u0432\u0435\u0440\u0441\u0438\u0442\u0435\u0442\u0443 \u041f\u043e\u0434\u0456\u043b\u043b\u044f. \u2013 \u0425\u043c\u0435\u043b\u044c\u043d\u0438\u0446\u044c\u043a\u0438\u0439 : \u0422\u0423\u041f, 2002. \u2013 \u2116 4, \u0447. 1. \u2013 \u0421.\u00a018\u201325.<\/li>\n<\/ol>\n

    References<\/strong><\/p>\n

      \n
    1. Robertson C. T. Printed Circuit Board Designer’s Reference: Basics \/ C. T. Ro-bertson. \u2013 New Jersey : Prentice Hall Professional, 2003. \u2013 277 \u0440.<\/li>\n
    2. Tong J. P. C. A DMAIC approach to printed circuit board quality improvement \/ J. P. C. Tong, F. Tsung, B. P. C. Yen \/\/ The International Journal of Advanced Manufacturing Technology. \u2013 London : Springer, 2004. \u2013 Vol. 23, Issue 7\u20138. \u2013 \u0420. 523\u2013531.<\/li>\n
    3. Electronic packaging: design, materials, process, and reliability \/ John H. Lau, C. P. Wong, John L. Prince, Wataru Nakayama. \u2013 New York : McGraw-Hill Professional, 1998 \u2013 496 p.<\/li>\n
    4. DSTU 2634\u201394. Electronic components. Methods of estimation of conformity with demands on dependability. \u2013 Valid from 1995-07-01. \u2013 Kiyv : Derszspozhivstandard of Ukraine, 1995. \u2013 4 p.<\/li>\n
    5. DSTU 7655:2014. Electronic components. General standards for reliablilty and testing methods. \u2013 Valid from 2015-07-01. \u2013 Kyiv : Derszspozhivstandard of Ukraine, 2009. \u2013 9 p.<\/li>\n
    6. DSTU 8216:2015. Electronic components. Classification by conditions of expoitation and standards of resistance to external impacts. \u2013 Kyiv : Derszspozhivstandard of Ukraine, 2017. \u2013 11 p.<\/li>\n
    7. Reliability prediction for space radio engineering devices based on the simulation of stress-strain conditions : Monograph \/ S. B. Suntsov, V.P. Alekseev, V.M. Karaban, S.V. Ponomarev. \u2013 Tomsk : Publishing of Tomsk. st. un. of control systems and radio engineering, 2012. \u2013 114 p.<\/li>\n
    8. Talitskii E. N. Protection of electronic devices from mechanical impacts. Theoretical fundamentals \/ E. N. Talitskii. \u2013 Vladimir : Vladimir st. un., 2001. \u2013 256 p.<\/li>\n
    9. Singh \u0422. Failure Modes and Mechanisms in Electronic Packages \/ \u0422. Singh., P. Viswanadham. \u2013 Boston : Chapman & Hall, MA: Springer, 1998. \u2013 \u0420. 363.<\/li>\n
    10. Calculation of mechanical stresses in adjoint system of electronic component and compound and strength assessment \/ V. Royzman, S. Petrashchuk, I. Kovtun, A. Lokoshchenko \/\/ Journal of Vibroengineering. \u2013 Vilnius, 2013. \u2013 Vol. 15, Issue 1. \u2013 P. 65\u201371.<\/li>\n
    11. Strength of materials \/ G. S. Pisarenko, V. A. Agaev, A. L. Kvitka, V. G. Popkov, Y. S. Umanskiy. \u2013 2-nd Edition. \u2013 Kiev : Technika, 1967. \u2013 792 P.<\/li>\n
    12. Petrashchuk S. Solving Problem of Thermal Conduction for Providing Strength of Electronic Units on Thermal Impacts \/ S. Petrashchuk, I. Kovtun, A. Voznyak \/\/ Heat and Mass Transfer in the System of Thermal Modes of Energy. Technical and Technological Equipment (HMTTSC-2016): MATEC Web of Conferences (Tomsk, April 19-21, 2016). \u2013 Vol. 72, P. 5.<\/li>\n
    13. Kovtun I. Thermal stress in encapsulated electronic packages \/ I. Kovtun , S. Petrashchuk, J. Boiko \/\/ Proceedings of the IEEE International Conference on Information and Telecommunication Technologies and Radio Electronics (UkrMiCo), (Odessa, Ukraine, 9\u201313 September, 2019). \u2013 \u0420. 6.<\/li>\n
    14. Royzman\u00a0V.\u00a0P. Identification of physical and mechanical characteristics of polymeric materials \/ V.\u00a0P. Royzman, I.\u00a0I. Kovtun, S.\u00a0A.\u00a0Petrashchuk \/\/ Herald of Technological universitye of Podillia. \u2013 Khmelnitsly : TUP, 2002. \u2013 4, Iss. 1. \u2013 P.\u00a018-25.<\/li>\n<\/ol>\n

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